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NSTC LEAP Program Training Questionnaire

  • Dear Sir/Madam,
  • It's such a great honor to have you joining LEAP Program. For finding your candidates to intern in your company, please spare some time to complete and submit this questionnaire by the August 23th 17:00.

  • The more accurate and clear you fill in, the better LEAP Program comprehend your company. If there's any question in mind, feel free to contact LEAP Program Office.

  • We sincerely appreciate your kind cooperation.

  • Warm regards,
  • LEAP Program Office
  • Email:leap@narlabs.org.tw
  • Phone: +886-2-2737-7747 or +886-2-2737-7965
  • (Office hour: 10am-5pm, UTC+8)

  • A. Company Basic Information

  • 1. *

  • 2.Company Registered Name *

  • 3. Company Logo *
    (Please upload the file of your company logo or send it to leap@narlabs.org.tw The digital image must be clearly visible and at high resolution.)
    Upload now!
    Yes, I have sent the logo file to LEAP Email address

  • 4. Company Official Website *

  • 5. Company Headquarter Address *
    (e.g. 14F, No. 106, Sec. 2, Heping E. Rd., Taipei 10636, Taiwan) If your company has several offices in different countries/cities, please provide the location that the candidate(s) will be trained for LEAP Program.

  • 6. Full-Time Employee Number
  • 6.1 Total Full-Time Employees number of your company *
    (e.g. total 500 full-time employees in your company) If your company has several offices in different countries/cities, please provide the number of the full-time employees in total

  • 6.2 Full-Time Employees number on the training site.*
    (e.g. 50 full-time employees on the training site) If your company has several offices in different countries/cities, please provide the number of the full-time employees of the office on the training site

  • 7. Company Industry Field

  • 7.1 Company Main Industry Field *
    (e.g. Semiconductor, Artificial Intelligence, Biotechnology)

  • 7.2 Company Second Main Industry Field
    (e.g. Semiconductor, Artificial Intelligence, Biotechnology)

  • 8. Company Official Founded in *
    (e.g. July 1989)

  • 9. Fundraising Status for companies founded within 3 years

  • 9.1. What’s the status of funding?
    (e.g. Angel / Pre-seed / Seed / Pre-A / A / B / C… )

  • 9.2. When did your company receive the above mentioned funding? (yyyy/mm)

  • 9.3. What’s the amount of the funding?
    (e.g. less than 1 million / 1~10 million / …)

  • 9.4. Have your company received any governmental/ research funding/ grant before? If so, what was it?

  • 10. Company Brief Introduction *

  • 11. Contact Information

  • 11.1. Full Name & Title *

  • 11.2. Phone Number *

  • 11.3. Email *

  • 12.Substitute Contact Person
    (If the contact person is out of the office for a period of time, please provide a substitute contact person regarding LEAP Program in case there’s critical procedure needed to be done. However, if the main contact still be responsible for LEAP Program during the vacation, please give us a direct contact way to make sure the communication will go smoothly. )

  • 12.1. Full Name & Title*

  • 12.2. Phone Number *

  • 12.3. Email*

    • B. Internship Information
    Next, you will fill in the internship information. Please follow the rule to fill in one by one. And if you have one position with two job descriptions, you shall fill in two positions with separate job description. It means there are two types of LEAP trainees you’re looking for.

    If there are more than 4 positions you would like to open for hosting, please write to LEAP Program Office.

    For training title of the position, you may fill in: Engineer, Data Scientist etc.

    For number of openings, it means for each position, how many LEAP trainees you plan to host. You may fill in 1 person or 2 persons/people.

    For field, it means for each position, what industrial field is that. You may fill in: Semiconductor, Biomedical etc.

    For detailed internship description, you shall elaborate what the internship description/ content will be so we would understand what will LEAP trainee is expected to do in your company.

    For location of the position, please fill in the host team of the particular position’s address. Some host companies have different sites that host different trainees. This is just to make sure where the trainee will be trained for this particular position.

  • 13. Training/Internship Title of Position 1 (e.g. Engineer/ Data Scientist…) *

  • 13.1.Number of openings *
    (e.g. 2 persons) For the internship location in the U.S., please be noted that the J-1 Visa "5 full-time employees to every 1 international intern" guideline.

  • 13.2. Field *
    (e.g. Semiconductor)

  • 13.3. Detailed Internship Description *
    (e.g. Monitor machines that slice silicon crystals into wafers for processing; use robots to clean and polish the silicon wafers)

  • 13.4. Location of This Position*
    (e.g. 14F, No. 106, Sec. 2, Heping E. Rd., Taipei 10636, Taiwan)

  • 14. If you have more than one (1) position, please fill up in the following sequence.
    Training/Internship Title of Position 2

  • 14.1.Number of openings
    (e.g. 2 persons) For the internship location in the U.S., please be noted that the J-1 Visa "5 full-time employees to every 1 international intern guideline.

  • 14.2. Field
    (e.g. Semiconductor)

  • 14.3. Detailed Internship Description
    (e.g. Monitor machines that slice silicon crystals into wafers for processing; use robots to clean and polish the silicon wafers)

  • 14.4. Location of This Position
    (e.g. 14F, No. 106, Sec. 2, Heping E. Rd., Taipei 10636, Taiwan)

  • 15. If you have more than two (2) positions, please fill up in following sequence.
    Training/Internship Title of Position 3

  • 15.1.Number of openings
    (e.g. 2 persons) For the internship location in the U.S., please be noted that the J-1 Visa "5 full-time employees to every 1 international intern" guideline.

  • 15.2. Field
    (e.g. Semiconductor)

  • 15.3. Detailed Internship Description
    (e.g. Monitor machines that slice silicon crystals into wafers for processing; use robots to clean and polish the silicon wafers)

  • 15.4. Location of This Position
    (e.g. 14F, No. 106, Sec. 2, Heping E. Rd., Taipei 10636, Taiwan)

  • 16. If you have more than three (3) positions, please fill up in following sequence.
    Training/Internship Title of Position 4

  • 16.1.Number of openings
    (e.g. 2 persons) For the internship location in the U.S., please be noted that the J-1 Visa "5 full-time employees to every 1 international intern" guideline.

  • 16.2. Field
    (e.g. Semiconductor)

  • 16.3. Detailed Internship Description
    (e.g. Monitor machines that slice silicon crystals into wafers for processing; use robots to clean and polish the silicon wafers)

  • 16.4. Location of This Position
    (e.g. 14F, No. 106, Sec. 2, Heping E. Rd., Taipei 10636, Taiwan)

  • C. Other Information
    17.Know about LEAP Program

  • 17.1 Who did you hear about LEAP Program from? *

  • 17.2. How did you hear about LEAP Program? * (Please provide full name and organization if there’s recommender) *

  • 18.Other additional information you’d like to share with LEAP Program Office?