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Chirp Microsystems

Company: Chirp Microsystems
Website: http://www.chirpmicro.com/
Location: Berkeley, California, USA
Employees: 15
Industry: Semiconductor; Ultrasonic sensors
Founded:  2013
Introduction:  Chirp Microsystems is bringing ultrasound to everyday products. Chirp’s piezoelectric micromachined ultrasonic transducers enable products that perceive the three-dimensional world we live in. Combined with Chirp’s embedded software library, these sensors enable new user interfaces for wearables, IoT and smart-home, virtual reality and augmented reality (AR/VR), and many more products. Learn more at www.chirpmicro.com. Chirp is located in vibrant downtown Berkeley near UC Berkeley.

Founded in 2013, Chirp Microsystems, Inc. designs, develops, and manufactures a line of extremely low power, ultrasonic 3D-sensing solutions for consumer electronics, smart homes, industrial automation, and much more.
   
Opening A:  1 intern: a product engineer, a characterization engineer and a sensor fusion engineer
Field: Semiconductors and software
Description:  The Product Engineer and Characterization Engineer will participate in the characterization and testing of our products. The ideal candidates will have semiconductor or MEMS packaging, characterization, and reliability experience.  The Sensor Fusion Engineer will help advance Chirp’s uBeacon inside-out tracking solution which fuses ultrasonic sensor data with inertial sensor data to provide low-latency, high-accuracy 6-DOF motion tracking for VR/AR/MR systems.
   
Opening B:  1 person
Field: MEMS Product Engineer
Description:  Chirp Microsystems is bringing ultrasound to everyday products. Chirp’s piezoelectric micromachined ultrasonic transducers enable products that perceive the three-dimensional world we live in. Combined with Chirp’s embedded software library, these sensors enable new user interfaces for wearables, IoT and smarthome, virtual reality and augmented reality (AR/VR), and many more products. Learn more at www.chirpmicro.com. Chirp is located in vibrant downtown Berkeley near UC Berkeley.

Chirp Microsystems is looking for a Product Engineer to participate in the characterization and testing of our products. The ideal candidate will have semiconductor or MEMS packaging, characterization, and reliability experience. The candidate must combine technical skills with the ability to communicate ideas effectively verbally and in writing.

Job Responsibilities: ● Characterize device performance; develop test apparatus and test software ● Plan and execute qualification and reliability testing to industry standards such as JEDEC ● Perform and document failure analysis ● Develop and implement yield enhancement and quality improvement programs such as statistical process control ● Interface with suppliers to resolve production issues and implement process improvements ● Occasional travel to suppliers in Asia and Europe

Required Skills: ● BS, MS, or PhD in Electrical Engineering or equivalent ● 5+ years’ experience in semiconductor or MEMS manufacturing ● Knowledge of SPC ● Ability to communicate ideas clearly and concisely ● Organized; a self-starter

Desired Skills: ● Experience with semiconductor or MEMS testing ● Understanding of MEMS/semiconductor packaging ● Familiarity with reliability testing methodology ● Programming language: Python
   
Opening C:  1 person
Field: MEMS Characterization Engineer
Description:  Chirp Microsystems is bringing ultrasound to everyday products. Chirp’s piezoelectric micromachined
ultrasonic transducers enable products that perceive the three-dimensional world we live in. Combined with
Chirp’s embedded software library, these sensors enable new user interfaces for wearables, IoT and smarthome,
virtual reality and augmented reality (AR/VR), and many more products. Learn more at
www.chirpmicro.com. Chirp is located in vibrant downtown Berkeley near UC Berkeley.

Chirp Microsystems is looking for a MEMS Characterization Engineer to drive the characterization and testing
of our products. The ideal candidate will have semiconductor or MEMS characterization, testing, and reliability
experience. The candidate must combine technical skills with the ability to communicate ideas effectively
verbally and in writing.

Job Responsibilities:
● Develop characterization methods, test apparatus and software - from concept to HVM
● Collect sensor characterization data, validate key performance metrics, identify trends and root causes
● Perform and document failure analysis
● Ensure products meet Chirp and customer specifications

Required Skills:
● MS or PhD in Electrical Engineering or equivalent
● 5+ years’ experience in semiconductor or MEMS manufacturing
● Experience with benchtop instruments, basic laboratory electronics, and data acquisition

hardware/software
● Experience with data analysis software (Matlab, JMP, etc)
● Solid understanding of time-domain and frequency-response characterization methods
● Ability to communicate ideas clearly and concisely
● Organized; a self-starter

Desired Skills:
● Familiarity with ultrasonic or acoustic sensors
● Experience with semiconductor or MEMS testing
● Understanding of MEMS/semiconductor packaging
● Familiarity with reliability testing methodology
● Programming language: Python
   
Updated on 2017/08/21.