變換字體大小 * * *

Chirp Microsystems

Company: Chirp Microsystems
Website: www.chirpmicro.com
Location: Berkeley, CA
Employees: 16 full-time employees at the training site
Industry: Ultrasonic 3d sensing
Founded:  Jan 2013
Introduction:  Chirp Microsystems, a TDK company, is bringing ultrasound to everyday products. Chirp’s piezoelectric micromachined ultrasonic transducers enable products that perceive the three-dimensional world we live in. Combined with Chirp’s embedded software library, these sensors enable new user interfaces for wearables, IoT and smart-home, virtual reality and augmented reality (AR/VR), and many more products. Learn more at www.chirpmicro.com. Chirp is located
in vibrant Berkeley.
   
Opening A:  1 person
Field: Ultrasonic Sensors
Description:  Mechanical Engineer:
Chirp is currently searching for a talented mechanical engineer to take ideas from concept to application. This includes designing, modeling, building, and testing prototypes. Skills shall include expert level use of mechanical design automation tools (Solidworks, etc.), knowledge of mechanical analysis techniques (acoustic analysis, FEA, etc.), and manufacturing (3D printing,
machining, molding, etc.) with a passion for problem solving, root cause analysis, and great industrial level mechanical design. As part of a small cross-disciplinary engineering team, working on everything from MEMS to ultrasonic acoustic design to firmware optimization, every day will provide a new challenge.

Job Responsibilities:
· Design and upgrade test systems for product characterization/qualification
· Design and improve components for VR/AR systems
· Conduct multiphysics FEA of ultrasonic transducers
· Support the test engineering team by designing custom parts for testing purposes
· Conduct bench testing, collect sensor characterization data, validate key performance metrics

Required Skills:
· PhD in Mechanical Engineering or equivalent
· Knowledge of FEA techniques and tools (COMSOL, ANSYS, etc.)
· Proficiency with CAD tools (Solidworks, etc.)
· Ability to communicate ideas clearly and concisely verbally and in writing
· Organized and detail oriented; a self-starter
Desired Skills:
· Experience with design for manufacturing of high-volume consumer products
· Experience with FMEA, quality systems, and/or reliability testing
· Experience in MEMS/semiconductor packaging
· Experienced with computational modeling of acoustic systems
· Proficiency with Python, JMP
   
Opening B:  1 person
Field: Ultrasonic Sensors
Description:  Software Engineer:
Chirp Microsystems is looking for a talented software engineer to lead the design and development of our software solutions. The ideal candidate will have full stack experience, including firmware development for low power embedded systems and high level application development on PC, mobile, or web based platforms.

Job Responsibilities:
Lead the design, development, testing, and deployment of software projects
Define software requirements for future products
Integrate Chirp’s sensors into different development platforms based on customer requirements
Design and create demonstrations that showcase Chirp’s ultrasonic sensor technology

Requirements:
· Ph.D. in Computer Science or Electrical Engineering
· Programming languages: C/C++, Python, Java
· Version control: Git, SVN
· Passion for writing efficient and scalable code
· Ability to communicate ideas clearly and concisely
Desired Skills:
· Experience with unit testing, build systems, and continuous integration
· Experience with embedded systems or device driver development
· Experience with Linux or Android
· Experience in digital signal processing, control systems or machine learning
· Practical experience with classification and Kalman filtering techniques
· Practical experience with signal processing
· Understanding of noise, statistics, and frequency domain concepts
· Experience with baseband digital signal processing
· Embedded hardware experience
· Familiarity with Linux and/or MATLAB
· Experience with ultrasound and/or acoustic signal processing